ThermoTechnologies divests its Special Wires business to Fisk Alloy Inc.
ThermoTechnologies announced on March 24, 2026, that it has reached an agreement with Fisk Alloy Inc. for the sale of its Special Wires business, which specializes in the production of high‑performance copper alloy wires.
The transaction involves the sale of 100% of the share capital of FSP one (Pont‑de‑Chéruy, France), as well as its distribution subsidiaries IWT (United States) and TSI (China). It opens a new chapter of development for the Special Wires business and marks a major milestone in ThermoTechnologies’ strategic evolution.
For ThermoTechnologies, this transaction is part of its strategy to continue its development while focusing its investments on its core activities: surface coating, EDM wires, heat treatment, diamond wires, and copper alloys. Supported by its industrial sites in France, Vietnam, and Switzerland, ThermoTechnologies will accelerate growth in its high‑potential markets in France and internationally.
This step marks a new phase in the Group’s development, reaffirming its commitment to pursuing industrial growth while sustainably supporting its customers in demanding and constantly evolving markets.
For Fisk Alloy Inc., the acquisition of ThermoTechnologies’ Special Wires business will give rise to a leading global player in high‑end specialty wires for high‑technology applications. Fisk Alloy Inc. benefits from a strong industrial and commercial presence in the United States, centered around its main production site in New Jersey, while FSP one is firmly established in Europe with its industrial site in Pont‑de‑Chéruy, France. FSP one will also benefit from ThermoTechnologies’ footprint in Vietnam and will maintain an industrial supply relationship with this site.
About Fisk Alloy Inc.
Founded in 1973 and led by Eric Fisk, Fisk Alloy Inc. is a recognized US leader in the manufacturing of specialty copper alloy wires for high‑performance connectors and conductors. The company serves cutting‑edge technology markets such as aerospace, electronics, and medical technologies.
